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1991 Proceedings International Conference on Wafer Scale Integration
January 29-31, 1991 San Francisco, California, USA
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1991 Proceedings International Conference on Wafer Scale Integration
Hardback ISBN: 9780818691263
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- Book Details
| ISBN | 818691263 |
| ISBN13 | 9780818691263 |
| Publisher | IEEE Computer Society Press,U.S. |
| Format | Hardback |
| Publication date | 15/06/2006 |
| Pages | 342 |
| Weight (grammes) | 751.00 |
| Published in | United States |
| Height (mm) | 230 |
| Width (mm) |






